Lenovo Legion Y70 (2026) will be launched in China on May 19 with an octa core Snapdragon 8 Gen 5 chipset from Qualcomm, which is built on a 3nm process, the company has confirmed. The gaming smartphone will also be equipped with a vapour chamber cooling solution to avoid overheating and throttling, featuring a 5,500 sq mm heat dissipation area, offering 12W liquid metal thermal conductivity and 10W “high thermal conductivity gel” (translated from Chinese). The upcoming handset is confirmed to be backed by an 8,000mAh “Star Ring” battery.